Detailed Product Description

The three key steps in surface-mount technology are paste, place, and reflow.

In the first step, solder paste must be accurately placed onto a PCB with the aid of a stencil printer, which deposits the paste into the pattern of the circuit.

Next, the electronic components are precisely placed onto the board using a manual or automatic pick and place system.

Finally, the solder paste must be heated until it melts and forms strong and reliable joints between the components and the surface of the board. This is accomplished through the use of a reflow oven which heats the solder to the proper temperature and then cools it down to a solid again